 | 
|
 bout
Cooler Master HTK-002 thermally conductive compounds are grease-like
silicone materials, heavily filled with heat conductive metal oxides.
This combination promotes high thermal conductivity, low bleed and
high-temperature stability. These compounds resist changes in
consistency at temperatures up to 177°C (350°F), maintaining a positive
heat sink seal to improve heat transfer from the electronic device to
the heat sink or chassis, thereby, increasing the overall efficiency of
the device.
|
 eatures
- Suitable for CPU, chipsets on Mainboard, VGA card, etc.
- Easy to use.
- Zif Socket Templates ensure correct applying area with various CPU
socket types.
- Produces an even layer when using applicator.
- Dielectric.
- Wide range of application temperature.
|
 pecifcations
|
Form |
1 Part |
|
Color |
White |
|
Viscosity/Flowability |
Nonflowing |
|
Specific Gravity
(cured) |
2.37 |
|
Shelf Life |
24 months from DOM |
|
Dielectric Constant |
4.4 at 100k Hz |
|
Volume Resistivity |
5.0 x 1015 |
|
Dissipation Factor |
0.02 at 100k Hz |
|
Dielectric Strength |
550 volts/mil; 21.7
kV/mm |
|
Thermal Conductivity |
0.8 watts/meter- °C |
|
dditional
Information
Installation Guide: Cooler Master Thermal Compound (HTK-002)
FAQ: Cooler Master Thermal Compound (HTK-002)
Product Release Sheet: Cooler Master Thermal Compound ( HTK-002)
Thermal Interface Material
|
|
